Description: Glaze FP fluorescence paste transparent fluorescence glaze, for full surface glaze fluorescence effect low-temp 730-800C.
Q: What is G19 Glaze (FP) in CERAMIX STAIN low-temp glaze paste?
A: G19 Glaze (FP) is Glaze FP fluorescence paste transparent fluorescence glaze, for full surface glaze fluorescence effect low-temp 750-800C. Part of CERAMIX STAIN G01-G20 20-color low-temp glaze paste for zirconia press ceramic glass ceramic external staining. Paste form high color stability low-temp 730-800C.
Q: What is G19 Glaze (FP) used for? Gum shade or tooth shade or effect?
A: G19 Glaze (FP) used for auxiliary effect shadow crack white glaze sealing – Glaze FP fluorescence paste transparent fluorescence glaze, for full surface glaze fluorescence effect low-temp 750-800C.. Achieves natural appearance restoration.
Q: How to use G19 Glaze (FP) low-temp paste? Firing temperature and glaze with G19 G20?
A: Apply G19 Glaze (FP) thin layer with brush on zirconia press ceramic glass ceramic after sintering, for deep use directly, for light mix with G20 Glaze or G19 FP. Fire at 730-800°C low-temp. Then seal with G19 Glaze FP for fluorescence anterior or G20 Glaze for non-fluorescence. One bake stain and glaze. Paste easy to control no dripping.
Q: Can G19 Glaze (FP) be mixed with other G shades? Is it for zirconia only or also lithium disilicate?
A: Yes mixable G01-G18 all mixable to create any shade, multi-shade combination. Universal for zirconia, lithium disilicate press ceramic E.max, glass ceramic veneers. Low-temp paste not affecting substrate strength, suitable for all all-ceramic external staining.
Q: What is the difference between G19 Glaze (FP) and resin stain R series? Can G series be used on resin?
A: G19 Glaze (FP) is ceramic low-temp glaze paste firing 730-800C for zirconia press ceramic glass ceramic, requires furnace. R series Polyfix R01-R20 is resin stain light-cured ≤30s no furnace for 3D printed resin PMMA PEEK composite. G series cannot be used on resin, R series cannot be used on ceramic. Separate systems: G for ceramic ceramic firing, R for resin light curing.